Electronic components mounted on substrates require heat sinks to effectively dissipate heat and maintain a stable operating temperature. Molybdenum-copper, tungsten-copper, CMC, and CPC materials combine the low thermal expansion coefficients of molybdenum and tungsten with the high thermal conductivity of copper. They effectively dissipate heat from electronic devices and aid in cooling various products, such as IGBT modules, RF power amplifiers, and LED chips.
1. Tungsten-copper alloy
Tungsten-copper alloy is a two-phase pseudo-alloy composed of tungsten as the base element and copper as the secondary element. It is a composite material among metals. WCu electronic packaging sheets combine the low thermal expansion properties of tungsten with the high thermal conductivity of copper. More importantly, their thermal expansion coefficient and thermal and electrical conductivity can be tailored by adjusting the material composition, greatly facilitating their application. We utilize high-purity, high-quality raw materials, and through pressing, high-temperature sintering, and infiltration, we produce high-performance WCu electronic packaging materials and heat sinks. They are suitable for packaging high-power devices, such as substrates and electrodes; high-performance lead frames; and thermal control plates and heat sinks for thermal control devices.
Advantages: Coefficient of thermal expansion (CTE) matching that of various substrates and high thermal conductivity; excellent high-temperature stability and uniformity; and excellent processability.
2. Molybdenum-Copper Alloy
Molybdenum-Copper Alloy is a pseudo-alloy composed of two immiscible metals, combining the properties of molybdenum and copper. It exhibits high thermal conductivity, low CTE, non-magnetic properties, low gas content, good vacuum performance, excellent machinability, and exceptional high-temperature performance.
3. Copper-Molybdenum-Copper-Copper, Copper-Molybdenum-Copper
CPC (Copper-Molybdenum-Copper-Copper) and CMC (Copper-Molybdenum-Copper) are three-layer structural materials. With a lower CTE and thermal conductivity far superior to WCu and MoCu, CPC and CMC offer superior alternatives for high-power electronic components. They effectively dissipate heat from electronic devices, facilitating cooling of various products, such as IGBT modules. They can be used as low-expansion layers and thermal paths in heat sinks, leadframes, and multilayer printed circuit boards (PCBs). We can provide customers with laminated materials in various thicknesses and with varying numbers of layers to meet their diverse application requirements.
4. Silicon-Aluminum Alloys
Silicon-aluminum alloys have a density between 2.3 and 2.7 g/cm³, and a coefficient of thermal expansion (CTE) between 4.1×10−6 and 23.6×10−6/K. Increasing the silicon content significantly reduces the alloy’s density and CTE. Silicon-aluminum alloys also offer excellent thermal conductivity, high specific stiffness, excellent plating properties with gold, silver, copper, and nickel, and solderability to substrates. Si-30Al has a CTE of 6.5×10−6/K, close to that of Si and GaAs. Its thermal conductivity reaches 120 W/m·K, and its density is 2.4 g/cm³, making it nearly 15% lighter than pure aluminum. Its specific stiffness (53 MPa·cm³/g) is three times that of Kovar alloy (17 MPa·cm³/g) and 3.5 times that of WCu25 (15 MPa·cm³/g). High-silicon aluminum alloy will become a new packaging material that meets the needs of telecommunications, aerospace, defense, and other related electronic components.
5. Manufacturing Process
Leading-edge processes produce leading products. Different application areas have varying material performance requirements, and FOTMA employs diverse processing methods to meet these requirements.
FOTMA is one of the earliest institutions in China to engage in refractory metal material research. Our company’s heat sink materials, including tungsten-copper, molybdenum-copper, and silicon-aluminum, are internationally advanced and have successfully entered the high-end power semiconductor component industry.
Post time: Aug-29-2025