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Electronic Packaging Material

Electronic Packaging Material

  • Tungsten Copper WCu Heat Sink

    Tungsten Copper WCu Heat Sink

    Tungsten copper material can form a good thermal expansion match with ceramic materials, semiconductor materials, metal materials, etc., and is widely used in microwave, radio frequency, semiconductor high-power packaging, semiconductor lasers and optical communications and other fields.

  • CMC CuMoCu Heat Sink

    CMC CuMoCu Heat Sink

    Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides.