Electronic Packaging Material
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Molybdenum Copper Alloy (MoCu Alloy) Heat Sink
Molybdenum Copper Alloy (MoCu) is a sophisticated composite material strategically designed to combine the low coefficient of thermal expansion (CTE) and high stiffness of molybdenum with the exceptional thermal and electrical conductivity of copper. This unique pseudo-alloy, typically fabricated through powder metallurgy techniques involving the infiltration of a porous molybdenum preform with copper, delivers an unparalleled solution for advanced thermal management and electronic packaging challenges.
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Diamond Composite Materials
Diamond Composite Materials (DCM) represent a cutting-edge class of advanced engineering materials designed to push the boundaries of performance in applications characterized by extreme heat, wear, and demanding structural requirements. By ingeniously combining the unparalleled properties of synthetic diamond particles – renowned for their exceptional thermal conductivity, hardness, and stiffness – with various high-performance metallic or ceramic matrices (such as Copper, Aluminum, or Silicon Carbide), DCM achieve a synergistic blend of attributes unattainable by monolithic materials.
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Copper Molybdenum Copper Composite (CMC) Material
Copper Molybdenum Copper (CMC) composite material is an innovative laminar metal composite, fabricated by tightly bonding copper (known for its excellent thermal and electrical conductivity) with molybdenum (renowned for its low coefficient of thermal expansion (CTE) and high rigidity) through specialized processes such as roll bonding, diffusion bonding, or vacuum brazing. The typical structure consists of two copper layers sandwiching a molybdenum layer, i.e., Cu-Mo-Cu.
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Tungsten Copper WCu Heat Sink
Tungsten copper material can form a good thermal expansion match with ceramic materials, semiconductor materials, metal materials, etc., and is widely used in microwave, radio frequency, semiconductor high-power packaging, semiconductor lasers and optical communications and other fields.
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CPC material (copper/molybdenum copper/copper composite material)
Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides.