Copper Molybdenum Copper Composite (CMC) Material
Copper Molybdenum Copper Composite (CMC) Material
The Ideal Choice for High-Performance Thermal Management and Electronic Packaging
Product Overview
Copper Molybdenum Copper (CMC) composite material is an innovative laminar metal composite, fabricated by tightly bonding copper (known for its excellent thermal and electrical conductivity) with molybdenum (renowned for its low coefficient of thermal expansion (CTE) and high rigidity) through specialized processes such as roll bonding, diffusion bonding, or vacuum brazing. The typical structure consists of two copper layers sandwiching a molybdenum layer, i.e., Cu-Mo-Cu.
CMC material is designed to address the challenges faced by traditional monolithic materials in demanding electronic packaging and thermal management applications. Its core advantage lies in its ability to achieve a tunable coefficient of thermal expansion, allowing it to perfectly match various semiconductors (e.g., Si, GaAs, SiC, GaN chips) while maintaining excellent thermal and electrical conductivity. This makes it an indispensable advanced material for high-power devices, RF modules, and aerospace applications.
Key Features & Technical Advantages
Our Copper Molybdenum Copper (CMC) composite materials are produced with precision control and advanced processes, ensuring superior performance and reliability for our customers.
Tunable Coefficient of Thermal Expansion (CTE):By adjusting the thickness ratio of the copper and molybdenum layers, the overall CTE of the material can be precisely controlled, allowing for an ideal match with different semiconductor chips and packaging materials. This effectively mitigates thermal stress and enhances device reliability.
Excellent Thermal Conductivity: The copper layers provide superior thermal conduction paths, ensuring efficient heat transfer and dissipation, which effectively lowers the operating temperature of devices.
Exceptional Electrical Conductivity: The copper layers endow the material with excellent electrical conductivity, suitable for applications requiring good electrical connections.
High Strength & Rigidity: The molybdenum layer significantly enhances the overall strength, rigidity, and dimensional stability of the composite material, meeting structural support requirements.
Lightweight Advantage: Compared to traditional high-CTE-matching materials like Tungsten Copper (WCu), CMC offers a lower density while achieving similar CTE values, contributing to lightweight product designs.
Good Machinability & Solderability: The surface copper layer is easy to machine, electroplate, weld, and braze, facilitating subsequent packaging integration.
High Reliability:** Effectively suppresses thermal fatigue and stress concentration caused by thermal cycling, significantly extending the service life of electronic devices.
Versatile Customization: Boards or precision parts can be customized in various thicknesses, Cu-Mo ratios, and dimensions according to specific customer requirements.
Core Application Fields：
Leveraging its unique combination of properties, Copper Molybdenum Copper (CMC) composite material plays a crucial role in the following high-tech sectors:
Power Electronic Module Substrates: Used as heat sinks/substrates for high-power devices such as IGBT modules, MOSFETs, and PDMs, ensuring stable and reliable chip operation.
RF/Microwave Packaging: Substrates and covers for high-power RF devices, radar modules, and T/R modules, providing excellent thermal management and CTE matching.
LED Heat Dissipation Substrates: Heat sink carriers for high-power LED chips and modules, effectively extending LED life and improving luminous efficiency.
Laser Diode Mounts: Packaging bases for high-precision laser diodes and optical communication modules, guaranteeing long-term stability of optoelectronic devices.
MEMS Micro-Electro-Mechanical Systems Packaging: Used as substrates for MEMS chips requiring high dimensional accuracy and thermal stability.
Semiconductor Equipment Components: Critical structural and thermal management components in various semiconductor manufacturing equipment.
Aerospace & Military Applications: Thermal control components and electronic packaging in satellite and missile systems, as well as high-reliability communication equipment.
Our Advantages
Choosing our Copper Molybdenum Copper (CMC) composite material means choosing advanced quality, expertise, and reliability.
Technological Leadership: We master advanced composite material manufacturing processes, ensuring high interfacial bonding strength and stable, reliable performance.
Customized Solutions: Deep understanding of customer needs, providing professional material design, CTE calculation, and thickness ratio optimization recommendations for precise customization.
Rigorous Quality Control: Implementing a strict quality management system from raw material procurement to finished product dispatch, ensuring every batch meets international standards.
Professional R&D Team: Continuous investment in research and development, constantly optimizing product performance, and assisting customers in solving complex thermal management challenges.
Reliable Supply Chain: Stable raw material sourcing and efficient production management ensure timely delivery.
Competitive Pricing: Offering market-competitive prices while guaranteeing outstanding product quality.
Packaging & Storage
Packaging: Products are typically vacuum-sealed and protected with moisture-proof and shock-absorbing materials to ensure safety and quality during transport. Custom packaging such as wooden crates or cartons can be provided upon customer request.
Storage: Should be stored in a cool, dry, well-ventilated warehouse free from corrosive gases, at a moderate temperature, and away from acids, bases, and other chemicals to prevent surface oxidation or contamination.
Ordering Information
If you are interested in our Copper Molybdenum Copper (CMC) composite material products or have any custom requirements, please do not hesitate to contact us. We are dedicated to providing you with product catalogs, technical documentation (COA, MSDS, etc.), samples, and detailed quotations.
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