The tungsten-molybdenum-based microelectronic package heat sink materials developed by the TUNGSTENBUY technical team, including the tungsten-copper series, molybdenum-copper series, CMC series, S-CMC series, HS-CMC series, and CPC series, all meet the same quality standards as their international counterparts and have been recognized by renowned international clients.
Tungsten-copper series: Utilizing a unique powder metallurgy process, these products achieve near-perfect density, fine grains, and are defect-free. Their airtightness reaches 1 x 10-9 Pa/m³.s.
Molybdenum-copper series: Utilizing a unique powder metallurgy process, these products achieve near-perfect density, fine grains, and are defect-free. Their airtightness reaches 1 x 10-10 Pa/m³.s.
CMC Series, S-CMC Series, and HS-CMC Series: They offer stable interface thickness ratios and reliable interfacial bonding strength, capable of withstanding repeated thermal shocks up to 1000°C. The molybdenum core material eliminates the risk of cracking. HS-CMC is a unique high-thermal conductivity grade developed in collaboration with commercial partners. Our CMC can be stamped, even for complex heat pipe shapes with bosses and recesses, whereas comparable CMCs from domestic and international manufacturers cannot be stamped.
CPC Series: Stable interface thickness ratio; reliable interfacial bonding strength, capable of withstanding repeated thermal shocks up to 1000°C.
The advantage of our CPC lies in its exceptionally high-performance molybdenum-copper process (excellent rollability), which allows for higher rolling forces when compounding CPC, resulting in stronger interfacial bonding.
Copper Needle Plate Production Experience
In 2016, we began collaborating with BYD to develop copper needle plate heat dissipation for IGBTs. We currently produce nearly 200,000 units per month, and during this time, we have accumulated extensive experience. We currently manufacture over 30 types of copper needle plates, as well as dozens of curved flat panels, for IGBT manufacturers such as BYD, Silan Microelectronics, Wannianxin, SMIC, and Taizhou Xinfeng.
Technical Advantages of Copper Needle Plates
1. Ability to manufacture copper needle plates in various shapes
• Cylindrical, diamond, and elliptical needles, enabling us to meet all custom design requirements. The elliptical needle array has a fine pitch of 0.6 mm, providing a large contact area with the fluid and effectively dissipating heat. Extensive experience in adjusting the curvature of the needle plate.
2. Strong Technical Strength in Materials Science
• Precisely control copper material quality and manageable copper plate welding deformation, thereby ensuring high IGBT welding yields.
3. Strong Forging Technology
• The hardness of the copper needle plate after forging is above HV 120, and after welding, it reaches above HV 90. The high hardness of the needle ensures that the fine needle maintains a stable shape when subjected to pulsating fluid impact, ensuring a smooth and turbulent water flow, which is highly beneficial for improving heat dissipation efficiency.
4. Reliable Nickel Plating Technology
• Electroplating produces a uniform nickel layer thickness. Years of practical experience in needle plate nickel plating provide us with extensive experience.
5. We are currently promoting full automation of forging and machining processes. This fully ensures product consistency and will further improve CPK values.
6. Reliable Quality
• Each copper needle plate is fully inspected with a laser arc tester, with data recorded and marked.
7. Rich Product Range
• We can manufacture high-quality graphite molds and plastic cavities for our customers.
Experience in Electroplating Technology
Materials such as oxygen-free copper, CPC, CMC, and CIC do not require electroplating. Tungsten-copper and molybdenum-copper materials do require electroplating.
Using molybdenum-copper alloys as an example, the following illustrates:
Currently, customers primarily use three types of electroplating: nickel plating, nickel-silver plating, and nickel-copper plating. The latter uses copper, primarily for cost considerations. In reality, silver offers better solder wettability. We surface-treat molybdenum-copper products, then apply nickel plating and a protective atmosphere bake. After baking and inspection, the nickel-plated products are then silver- or copper-plated, and then baked and inspected.
The purpose of baking is, firstly, to allow for slight diffusion of nickel and molybdenum-copper, enhancing the bonding strength; secondly, to verify the conformity of the coating and check for blistering or delamination defects.
With nearly 30 years of experience in heat sink material production, we guarantee the quality of our products and the reliability of our electroplating.
Post time: Oct-28-2025