Heat sink material is a material used to absorb and dissipate heat. Its main function is to transfer heat from the heating components to a larger heat dissipation surface, in order to reduce the temperature of the heating components and ensure the normal operation of the equipment. These materials typically have high thermal conductivity and can quickly transfer heat from a heat source to a radiator or other heat dissipation device.
CPC multi-layer heat sink: Multilayer heat sink generally refers to a composite material with a sandwich structure of oxygen free copper as the surface material and molybdenum or molybdenum copper as the intermediate layer, which combines the high thermal conductivity of copper and the low thermal expansion coefficient of molybdenum, and the thermal expansion coefficient is adjustable.
CPC (Copper/Molybdenum Copper/Copper) multi-layer metal heat sink material is a composite material designed specifically for the field of microelectronic packaging. Its unique sandwich structure and high-performance characteristics make it a leader in thermal management solutions.
CPC material consists of three layers: the middle layer is made of molybdenum copper alloy (MoCu), and the two sides are pure copper layers (Cu).
The main advantages and characteristics of CPC multi-layer heat sink material are:
1. High thermal conductivity:
CPC heat sink material has high thermal conductivity, for example, the thermal conductivity of CPC232 reaches 350 W/(M · K). This means that it can quickly and effectively dissipate heat from the heat source, preventing electronic devices from being damaged due to overheating.
2. Low thermal expansion coefficient:
The thermal expansion coefficient of CPC heat sink material is relatively low and can be adjusted as needed. This characteristic enables it to achieve good thermal matching with ceramic materials, semiconductor materials, etc., reducing size changes and stress caused by temperature changes.
3. Designed coefficient of thermal expansion:
The thermal expansion coefficient of CPC heat sink material is designable, and can be customized according to different application scenarios and needs by adjusting the ratio of molybdenum copper alloy to pure copper. This flexibility enables CPC heat sink materials to adapt to various complex electronic packaging requirements.
4. High temperature resistance performance:
CPC heat sink material can withstand high temperature environments, with strong interface bonding and the ability to repeatedly withstand high temperature impacts.
5. High strength and excellent mechanical properties:
CPC heat sink material has high strength and excellent mechanical properties, and can withstand various mechanical stresses. This enables it to maintain stable performance in various complex working environments.
6. Non magnetic:
CPC heat sink material is non-magnetic and suitable for magnetic sensitive electronic devices and application scenarios.
7. Good processing performance:
CPC materials can be processed through methods such as rolling, electroplating, and explosive forming to produce various shapes and specifications of products that meet different electronic packaging needs.
Application of CPC composite heat sink material in chip packaging
Packaging substrate: CPC material is commonly used as a packaging substrate in chip packaging due to its high thermal conductivity (such as a thermal conductivity coefficient of up to 350W/m · K), which effectively conducts out the heat generated by the chip and reduces its operating temperature.
Packaging wall matching: CPC material has an adjustable coefficient of thermal expansion, which can be designed to be similar to the expansion coefficient of chips and ceramic substrates, thereby avoiding packaging failure caused by thermal stress and making the packaging structure more stable and reliable.
Multi layer printed circuit board (PCB) thermal conductivity channel: CPC material can also serve as a thermal conductivity channel for multi-layer printed circuit boards, ensuring the stability and reliability of the circuit board.
With the continuous development of microelectronics technology, the requirements for packaging materials are also increasing. CPC multi-layer metal heat sink material is gradually becoming one of the important materials in the field of microelectronic packaging due to its excellent performance characteristics and wide application areas. In the future, with the continuous advancement of preparation technology and the emergence of new materials, the application of CPC materials in the field of thermal management will be more extensive.
FOTMA ALLOY, as a high-quality manufacturer of CPC multi-layer heat sink materials, holds a leading position in the field of multi-layer metal heat sink, and CPC multi-layer metal heat sink has been steadily mass-produced. And it is highly praised for its excellent high thermal conductivity and adjustable coefficient of thermal expansion. Need a quote on a custom item or machined part? Questions on specifications, tolerances, or something else? Please fill out the form below if you need assistance, do not hesitate to contact our expert team!
Post time: Nov-04-2025