High-Performance CPC Heat Sink Materials

Heat sink materials are used to absorb and dissipate heat. Their main function is to transfer heat from heat-generating components to a larger heat dissipation surface, thereby reducing the temperature of the heat-generating components and ensuring the normal operation of the equipment. These materials typically have high thermal conductivity, enabling them to rapidly conduct heat from the heat source to the heat sink or other heat dissipation equipment.

CPC Multilayer Heat Sinks: Multilayer heat sinks generally refer to composite materials with a sandwich structure, using oxygen-free copper as the surface material and molybdenum or molybdenum-copper alloy as the middle layer. They combine the high thermal conductivity of copper with the low coefficient of thermal expansion of molybdenum, and the coefficient of thermal expansion is adjustable.

CPC (Copper/Molybdenum Copper/Copper) multilayer metal heat sink material is a composite material specifically designed for the microelectronics packaging field. Its unique sandwich structure and high-performance characteristics make it a leader in thermal management solutions.

CPC material consists of three layers: the middle layer is a molybdenum-copper alloy (MoCu), and the two outer layers are pure copper (Cu).

Key advantages and characteristics of CPC multilayer heat sink materials:

High thermal conductivity:
Low coefficient of thermal expansion:
Designable coefficient of thermal expansion:
High temperature resistance:
High strength and excellent mechanical properties:
Non-magnetic:
Good processability:

Applications of CPC composite heat sink materials in chip packaging:

Packaging substrate: Due to its high thermal conductivity (e.g., a thermal conductivity coefficient TC of up to 350 W/m·K), CPC material is commonly used as a packaging substrate in chip packaging, effectively conducting away the heat generated by the chip and reducing its operating temperature.

Packaging wall matching: CPC material has an adjustable coefficient of thermal expansion, which can be designed to be similar to the coefficient of thermal expansion of the chip and ceramic substrate, thereby avoiding packaging failure caused by thermal stress and making the packaging structure more stable and reliable.

Bottom expansion and heat conduction channel in multilayer printed circuit boards (PCBs): CPC material can also be used as a bottom expansion and heat conduction channel in multilayer printed circuit boards, ensuring the stability and reliability of the circuit board.

With the continuous development of microelectronics technology, the requirements for packaging materials are becoming increasingly stringent. CPC (Cyclic Polymer Multilayer Metal Heat Sink) materials, with their superior performance characteristics and wide range of applications, are gradually becoming one of the important materials in the microelectronics packaging field. In the future, with continuous advancements in manufacturing technologies and the emergence of new materials, the application of CPC materials in thermal management will become even more widespread.

FOTMA, as a leading manufacturer of CPC multilayer heat sink materials, holds a leading position in the field of multilayer metal heat sinks, and its CPC multilayer metal heat sinks are already in stable mass production. They are highly praised for their products’ excellent high thermal conductivity and adjustable coefficient of thermal expansion. Contact us for more info about CPC.