Copper-molybdenum copper-copper composites, abbreviated as CMCC or CPC, are “sandwich” structure composite materials with a core of metallic molybdenum copper and double-sided pure copper cladding. The thickness of each layer in a CMCC can be adjusted as needed, with common thickness ratios including 1:1:1, 1:3:1, 1:4:1, and 2:3:2.
The upstream of the CMCC industry chain is the raw material supply layer, mainly consisting of metallic copper and molybdenum copper. Molybdenum copper is a composite material of molybdenum and copper, with a density much lower than tungsten copper, and features high thermal conductivity and an adjustable coefficient of thermal expansion, making it particularly suitable for aerospace, electronic packaging, and communications fields. Molybdenum copper can be prepared through copper infiltration, mixture sintering, and injection molding.
According to the “2024-2029 China Copper-Molybdenum-Copper-Copper Composite Material (CPC) Industry Market In-depth Research and Development Prospects Forecast Report” released by the Nonferrous Metals Industry Research Center, while copper-molybdenum-copper-copper composite materials have a higher coefficient of thermal expansion than copper-copper-copper composite materials (CMC), they possess higher thermal conductivity, strength, and excellent reliability and heat dissipation. They are widely used in electronic packaging, thermal management, military, wireless communications, optical communications, aerospace, and other fields.
In recent years, with the development of the electronics industry, the trend toward higher power and miniaturization of semiconductor devices and integrated circuits has become increasingly pronounced. This has led to an increase in electronic packaging density and heat generation per unit area. To ensure the operational stability of integrated circuits and semiconductor devices, the development of highly thermally conductive and reliable electronic packaging heat sink materials has become a top priority. Copper-molybdenum-copper-copper composite materials are one of the heat sink composite materials used in microelectronic packaging, and the market demand is substantial.
Relevant standards for the copper-molybdenum copper-copper composite material industry include YS/T 1546-2022 “Molybdenum-Copper Alloy Plate” and YS/T 1595-2023 “Molybdenum-Copper Layered Composite Materials for Electronic Packaging,” etc. The publication and implementation of these standards provide important references for the standardized, regulated, and high-quality development of the copper-molybdenum copper-copper composite material industry.
Industry analysts indicate that copper-molybdenum copper-copper composite materials possess excellent heat dissipation capabilities and can match the thermal expansion coefficients of silicon semiconductors and ceramic substrates, offering broad application prospects in the electronic packaging field. Copper-molybdenum copper-copper composite materials use metallic copper and molybdenum copper as raw materials. my country has relatively abundant molybdenum and copper ore resources, which lays a solid raw material foundation for the development of the copper-molybdenum copper-copper composite material industry.
FOTMA ALLOY, covering an area of 78,000 square meters, has invested over 300 million yuan to build eight production lines, dedicated to the research, development, production, and sales of advanced tungsten-molybdenum-based metal materials such as heat sink materials for electronic packaging. The company’s main products include molybdenum copper (MoCu), tungsten copper (WCu), copper-molybdenum copper (CMC), copper-molybdenum copper-copper (CPC), and oxygen-free copper (OFC). We can produce sheets, plates, and customized products with coatings, such as base plates, flanges, carriers, steps, gaskets, electrodes, and bars. Our products are widely used in optical communications, microwave RF power devices, ceramic housings, and IGBT modules for electric vehicles, and are exported to South Korea, Japan, the United States, Germany, and other regions.
Post time: Oct-29-2025