With economic development and social progress, science and technology have also made significant strides, bringing unprecedented advancements to our production and lives. Especially since the beginning of the 21st century, the development of computer and information technologies has profoundly changed our lifestyles. During the rapid development of information technology, microelectronics technology emerged and gradually became the mainstream of my country’s scientific and technological development. As microelectronics technology advances, its power density increases accordingly. However, this has raised questions and higher demands regarding the reliability and cost-effectiveness of heat sink materials for microelectronic packaging. Currently, the development of microelectronics technology is progressing smoothly. Furthermore, since the development of microelectronics technology is closely related to the power of widely used electronic devices, the function of heat sink materials for microelectronic packaging is to absorb excess heat emitted by electronic components and transfer this excess heat to a lower temperature environment, thus ensuring that electronic components operate at a suitable temperature. The development of science and technology in the new era has promoted the progress of research on heat sink materials for microelectronic packaging. This paper analyzes the microstructure and performance characteristics of some existing heat sink materials for microelectronic packaging, understands the advantages and disadvantages of different materials, and, based on this, looks forward to the future research of heat sink materials for microelectronic packaging.
I. Current Status of Microelectronic Packaging Heat Sink Materials Research
With the continuous improvement of social informatization, global microelectronics technology is becoming increasingly advanced. Furthermore, the integration level of electronic materials in microelectronics is constantly increasing with technological advancements, leading to a significant increase in the relative power of electronic components. This development places higher demands on the reliability and cost-effectiveness of packaging heat sink materials. As research deepens, it is believed that the key to improving the power of electronic components lies in improving the reliability of packaging heat sink materials. Therefore, we need to continuously advance the research progress of microelectronic packaging heat sink materials to meet the demands of electronic components. The reason we have chosen to develop microelectronic packaging heat sink materials is due to two advantages: firstly, microelectronic heat sink materials can absorb the heat dissipated by electronic components; secondly, microelectronic heat sink materials can transfer the absorbed heat to a low-temperature environment, allowing the various parts of the electronic components to operate in a suitable temperature environment.
Different heat sink materials offer varying advantages. As metal heat sinks, their responsibilities include chip support, electrical connection, heat dissipation, and environmental protection. Therefore, our requirements for metal heat sinks are:
First, a low coefficient of thermal expansion to ensure proper matching between the heat sink and the chip;
Second, good thermal conductivity to guarantee heat dissipation;
Third, high electrical conductivity, crucial for stable operation of electronic components;
Fourth, good processing and forming capabilities are fundamental for the application of metal heat sinks in electronic devices;
Fifth, corrosion resistance and solderability are essential to ensure the lifespan of the metal heat sink;
Finally, the hermeticity of the metal heat sink must be guaranteed. We understand that metal heat sinks have coefficients of thermal expansion, and differences in these coefficients can lead to thermal stress within electronic components, even causing deformation. Therefore, it is crucial to assess the appropriateness of the coefficient of thermal expansion for packaging heat sinks. Due to their excellent properties, metal heat sinks have always been popular among electronic engineers and are widely used in the manufacturing process of electronic components.
II. Heat Sink Materials for Microelectronic Packaging my country has made significant progress in the research of heat sink materials for microelectronic packaging. Suitable metals for this purpose have been identified, such as Invar alloys and Kovar alloys. Each of these metals has its own advantages and disadvantages. We will analyze the current research status of heat sink materials for microelectronic packaging in my country by examining several such materials.
2.1 Molybdenum-Copper Alloy and Tungsten-Copper Alloy Copper can be mixed with tungsten and molybdenum in any proportion. Both tungsten-copper alloys and molybdenum-copper alloys are excellent heat sink materials for microelectronic packaging. Mixing these two different metals can meet the requirements of different coefficients of thermal expansion. Each alloy has its advantages: tungsten-copper alloys have enhanced thermal conductivity, while molybdenum-copper alloys have lower density, offering a significant quality advantage. These materials are typically prepared using powder mixing and melt doping methods. These methods increase the alloy density and stability.
2.2 CMC
CMC is a composite material consisting of three layers: top and bottom surfaces made of copper, and a middle layer of molybdenum. Different thickness ratios of the three metal layers can be adjusted to meet varying thermal expansion coefficient requirements. CMC is prepared using explosive bonding and rolling methods to ensure a tight bond between the three layers.
2.3 CPC
Similar to CMC, CPC is also a three-layer composite material. The top and bottom surfaces are made of copper, and the middle layer is a molybdenum-copper alloy. This significantly improves the material’s thermal conductivity. Its preparation method is the same as CMC. Like CMC, CPC also requires a tight bond between the three layers, and each layer must have a uniform thickness.
III. Development of Microelectronic Packaging Heat Sink Materials
With the continuous improvement of informatization, the complexity of electronic component manufacturing is also increasing, leading to increasingly higher performance requirements for microelectronic packaging heat sink materials. In fact, the development of microelectronic packaging heat sink materials in my country began around the same time as in developed Western countries. However, due to the gap in science and technology, my country’s development of microelectronic packaging heat sink materials has lagged behind Western countries. But in recent years, my country has made significant progress in heat sink material research. Microelectronic packaging heat sink materials are fundamental to the operation of high-power electronic components, resulting in high demand both domestically and internationally. Facing the vast international market, Chinese researchers, through tireless efforts, have not only launched new products but also developed high-end microelectronic packaging heat sink materials, with technology reaching international top levels. The development of tungsten-molybdenum metal-based heat sink materials has further propelled the development and progress of packaging heat sink materials in my country. It is believed that in the near future, my country’s research on microelectronic packaging heat sink materials will certainly be at the forefront of the world, possessing a strong core competitiveness internationally.
IV. Conclusion Research on heat sink materials for microelectronic packaging can effectively improve the power of electronic components. Therefore, the demand for heat sink materials is high both domestically and internationally. Although my country’s development in this area lagged behind international levels in the past, through the continuous efforts of Chinese researchers, my country has made significant progress in the research of microelectronic packaging heat sink materials, completely breaking the international monopoly on this material and enhancing my country’s core competitiveness in the international market.
The tungsten-molybdenum based microelectronic packaging heat sink materials developed by the FOTMA ALLOY technical team, including tungsten-copper series, molybdenum-copper series, CMC series, S-CMC series, HS-CMC series, and CPC series, all reach the quality level of international counterparts and are recognized by well-known international customers. Need a quote on a custom item or machined part? Questions on specifications, tolerances, or something else? Do not hesitate to contact our expert team!
Post time: Nov-07-2025