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OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink – Fotma

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We purpose to understand high quality disfigurement with the output and supply the top service to domestic and overseas buyers wholeheartedly for Tungsten Carbide Bits, Machining Fabrication, Titanium Aluminium Carbide, As an experienced group we also accept custom-made orders. The main intention of our firm is to build up a satisfying memory for all consumers, and set up a long-term win-win small business connection.
OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink – Fotma Detail:

Description

Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


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With our rich working experience and thoughtful companies, we have now been recognized as being a trustworthy supplier for a lot of global potential buyers for OEM Factory for N10276 Material - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Bolivia, Qatar, Auckland, Our product quality is one of the major concerns and has been produced to meet the customer's standards. "Customer services and relationship" is another important area which we understand good communication and relationships with our customers is the most significant power to run it as a long term business.
  • Reasonable price, good attitude of consultation, finally we achieve a win-win situation,a happy cooperation!
    5 Stars By Elma from French - 2018.07.12 12:19
    This manufacturers not only respected our choice and requirements, but also gave us a lot of good suggestions, ultimately, we successfully completed the procurement tasks.
    5 Stars By Daniel Coppin from Paraguay - 2018.06.03 10:17
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