Welcome to Fotma Alloy!
page_banner

products

Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink – Fotma

Short Description:


Product Detail

Product Tags

Related Video

Feedback (2)

We're commitment to offer you the competitive price ,remarkable products excellent, also as fast delivery for Parts Of A Cnc, Cnc Machine Working Company, Black Plated Tungsten, We welcome customers all over the word to contact us for future business relationships. Our products are the best. Once Selected, Perfect Forever!
Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink – Fotma Detail:

Description

Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


Related Product Guide:

We can always satisfy our respected customers with our good quality, good price and good service due to we are more professional and more hard-working and do it in cost-effective way for Low MOQ for Machining Metal - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Plymouth, Monaco, Bulgaria, Merchandise have been exported to Asia, Mid-east,European and Germany market. Our company has constantly been able to update the items performance and safety to meet the markets and strive to be top A on stable quality and sincere service. If you have the honor to do business with our company. we'll undoubtedly do our very best to support your business in China.
  • It is a very good, very rare business partners, looking forward to the next more perfect cooperation!
    5 Stars By Denise from Nigeria - 2017.10.27 12:12
    In general, we are satisfied with all aspects, cheap, high-quality, fast delivery and good procuct style, we will have follow-up cooperation!
    5 Stars By Marian from Mali - 2017.09.28 18:29
    Write your message here and send it to us