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2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma

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Our intention is usually to satisfy our buyers by offering golden provider, great rate and good quality for Titanium Carbide, Titanium Steel, Tungsten Electrode Holder, Since establishment in the early 1990s, we have set up our sale network in USA, Germany, Asia, and several Middle Eastern countries. We aim to be a top class supplier for worldwide OEM and aftermarket!
2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma Detail:

Description

Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


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We continue to keep increasing and perfecting our solutions and service. At the same time, we operate actively to do research and enhancement for 2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Guatemala, Poland, Nicaragua, Customer satisfaction is our first goal. Our mission is to pursue the superlative quality, making continual progress. We sincerely welcome you to make progress hand in hand with us, and construct a prosperous future together.
  • This supplier offers high quality but low price products, it is really a nice manufacturer and business partner.
    5 Stars By James Brown from Casablanca - 2017.11.29 11:09
    Good quality, reasonable prices, rich variety and perfect after-sales service, it's nice!
    5 Stars By Hellyngton Sato from Vietnam - 2017.08.15 12:36
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