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2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma

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We also offer product sourcing and flight consolidation services. We've got our personal factory and sourcing office. We can easily present you with almost every style of merchandise linked to our merchandise range for Cnc Machine Aluminum, Titanium Rotor Bolts, 1kg Tungsten, We are also constantly looking to establish relationship with new suppliers to provide innovative and smart solution to our valued customers.
2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma Detail:

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Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


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So as to provide you with ease and enlarge our business, we even have inspectors in QC Crew and guarantee you our best company and solution for 2021 China New Design Alloy 825 Material - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Chile, Myanmar, Macedonia, Ensuring high product quality by choosing the best suppliers, now we have also implemented complete quality control processes throughout our sourcing procedures. Meanwhile, our access to a large range of factories, coupled with our excellent management, also ensures that we can quickly fill your requirements at the best prices, regardless the order size.
  • The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Stephen from Australia - 2017.11.20 15:58
    We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
    5 Stars By Janet from Austria - 2017.11.12 12:31
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