Welcome to Fotma Alloy!
page_banner

products

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma

Short Description:


Product Detail

Product Tags

Related Video

Feedback (2)

Always customer-oriented, and it's our ultimate goal to get not only by far the most reputable, trustable and honest supplier, but also the partner for our customers for Cnc Precision Components, Tungsten, Copper Tungsten Bar, Our mission is to help you create long-lasting relationships with your clients through the power of promotional products.
18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma Detail:

Description

Tungsten copper electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material brought great convenience.

FOTMA uses high-purity and high-quality raw materials, and obtains WCu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. 

Tungsten Copper WCu Heat Sink

Advantages of Tungsten Copper (WCu) Electronic Packaging Materials

1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);

2. No sintering activation elements are added to maintain good thermal conductivity;

3. Low porosity and good air tightness;

4. Good size control, surface finish and flatness.

5. Provide sheet, formed parts, also can meet the needs of electroplating.

Copper Tungsten Heat Sink Properties

Material Grade Tungsten Content Wt% Density g/cm3 Thermal Expansion ×10-6  CTE(20℃) Thermal Conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Application of Tungsten Copper Heat Sinks

Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.


Product detail pictures:

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures

18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink  – Fotma detail pictures


Related Product Guide:

We constantly function like a tangible group to ensure that we can give you the very best high-quality and also the very best cost for 18 Years Factory 3d Printing Machining - Tungsten Copper WCu Heat Sink – Fotma , The product will supply to all over the world, such as: Spain, Romania, Durban, We have a large share in global market. Our company has strong economic strength and offers excellent sale service. We have established faith, friendly, harmonious business relationship with customers in different countries. , such as Indonesia, Myanmar, Indi and other Southeast Asian countries and European, African and Latin American countries.
  • We have worked with many companies, but this time is the best,detailed explanation, timely delivery and quality qualified, nice!
    5 Stars By jari dedenroth from Ottawa - 2018.06.05 13:10
    We are really happy to find such a manufacturer that ensuring product quality at the same time the price is very cheap.
    5 Stars By Sarah from Bahamas - 2017.11.11 11:41
    Write your message here and send it to us